Capability | |||
Layer | 1-36L | Min. finished thickness(2L) | 0.3mm |
Max. panel size | 1500mm*610mm | Min. finished thickness(multilayer) | 0.4mm |
Max. Cu thickness | 12OZ | Max. finished thickness | 4.0mm |
Min.Cu thickness(base) | 1/3OZ | Min. core thickness | 0.1mm |
Max.Cu thickness(base) | 5OZ | Drilling hole to hole tolerance | ±0.05mm |
Aspect ratio | 10:1 | Min. hole diameter tolerance (PTH) | ±0.075mm |
Etching tolerance | ±10% | Min. hole diameter tolerance (NPTH) | ±0.05mm |
Min.line with | 0.075mm(3mil) | Min. routing tolerance | ±0.10mm |
Min.line space | 0.075mm(3mil) | Min. stamping edge to edge tolerance | ±0.075mm |
Min. hole diameter | 0.20mm | V-cut edge to edge tolerance | ±0.10mm(4mil) |
Board bow and twist | ≤ 0.75% | Registration(O/L) | ±0.05mm(2mil) |
Impedance tolerance | ±10% | Paterning positioning tolerance | ±0.075mm(3mil) |
Hole copper thickness | 30um | Max.test points/Board(universal ET) | Jig Test Fixture:15000 Flying Probing:1-∞ |
Surface finish | HAL-LF,HASL,Immersion Gold,Immersion Silever,OSP | ||
Base material | FR-4, Hi-TG FR-4, Halogern free FR-4、CEM1、CEM3, Aluminum based boards | ||
Standard lead time | Multilayer:9 wds,2L:7wds,sample:3-6wds |
Product name | Product picture | Product parameters |
Application:Security |
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Material:FR4 Layer count:8L Finished copper:0.5/1/1/1/1/1/1/1/0.5OZ Surface finish:immersion gold Min. hole:0.2mm Line width /space:4mil/4mil |
Millimeter wave antenna board |
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Application:communication |
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Material:FR4 Layer count:4L Finished copper:1/1/1/1OZ Surface finish:OSP Min. hole:0.2mm Line width/space:4mil/2.1mil |
Rogers-4003C |
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Application: LED |
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Material: FR4 Layer count: 1L Finished thickness: 1.6mm Finished copper: 1Oz Line width/space:0.51/0.38mm Min. hole: 0.76mm Surface finish:Lead-free HASL |
Application:communication |
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Material:FR4 Layer count:6L Finished copper:1/1/1/1/1/1OZ Surface:immersion gold Min. hole:0.2mm Line width/space:4mil/4mil |