Capability | |||
Layer | 1-36L | Min. finished thickness(2L) | 0.3mm |
Max. panel size | 1500mm*610mm | Min. finished thickness(multilayer) | 0.4mm |
Max. Cu thickness | 12OZ | Max. finished thickness | 4.0mm |
Min.Cu thickness(base) | 1/3OZ | Min. core thickness | 0.1mm |
Max.Cu thickness(base) | 5OZ | Drilling hole to hole tolerance | ±0.05mm |
Aspect ratio | 10:1 | Min. hole diameter tolerance (PTH) | ±0.075mm |
Etching tolerance | ±10% | Min. hole diameter tolerance (NPTH) | ±0.05mm |
Min.line with | 0.075mm(3mil) | Min. routing tolerance | ±0.10mm |
Min.line space | 0.075mm(3mil) | Min. stamping edge to edge tolerance | ±0.075mm |
Min. hole diameter | 0.20mm | V-cut edge to edge tolerance | ±0.10mm(4mil) |
Board bow and twist | ≤ 0.75% | Registration(O/L) | ±0.05mm(2mil) |
Impedance tolerance | ±10% | Paterning positioning tolerance | ±0.075mm(3mil) |
Hole copper thickness | 30um | Max.test points/Board(universal ET) | Jig Test Fixture:15000 Flying Probing:1-∞ |
Surface finish | HAL-LF,HASL,Immersion Gold,Immersion Silever,OSP | ||
Base material | FR-4, Hi-TG FR-4, Halogern free FR-4、CEM1、CEM3, Aluminum based boards | ||
Standard lead time | Multilayer:9 wds,2L:7wds,sample:3-6wds |
Product name | Product picture | Product parameters |
PTFE laminate - Multilayer |
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Traditional antenna PCB |
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應用領域:LED照明 |
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板材:鋁基 層數:1L 板(ban)厚(hou):0.8mm 完成銅厚(hou):1OZ 表面處(chu)理:OSP |
應用領域:LED照明 |
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板材:鋁基 層數:1L 板厚:1.2mm 完成銅厚:1OZ 表面處理(li):OSP |
應用領域:LED照明 |
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板材(cai):鋁基 層數:1L 板厚:1.5mm 完(wan)成銅(tong)厚:1OZ 表(biao)面處理:OSP |
Application field: automotive power supply |
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材(cai)質: FR4 層數: 8L 板(ban)厚: 2.0mm 銅厚: 4Oz 最小孔徑: 0.9mm 表面(mian)處理: 無鉛噴錫 特性(xing): 厚銅 |